KATON^® PF92T is TPF fluoroelastomers (thermoplastic TPF fluoroelastomer) designed for high performance applications where both purity and chemical resistance are required, mainly for semiconductor manufacturing applications.
 
KATON^® PF92T Para-bridging structure filler: it reinforces the materials without the use of conventional contaminating fillers, such as carbon black or minerals. Mineral fillers such as BaSO4, TiO2, SiO2, aluminum oxide and aluminum silicate exhibit high plasma resistance: they can therefore shield the polymer, but may contaminate the chamber by leaving discrete particles as soon as the polymer is etched by plasma. On the other hand, thermoplastic and fluoroelastomer have similar etching rates, so that polymeric filled compounds can be completely etched to form volatiles, significantly reducing the potential for particle generation.

They are suitable for applications at temperatures ranging from –10 °C to 230°C. Their extreme cleanliness along with their good plasma and chemical resistance make KATON^® PF92T and PF92T the suitable sealing materials for most dry (plasma etching, PECVD, LPCVD, metal CVD, PVD, ALD, plasma cleans) and wet semiconductor processes (wafer cleaning, polymer removal, wet etching, polishing).

The primary use for KATON^® PF92T is the manufacturing of any kind of elastomeric sealing element such as chamber seals, lid seals, window seals, gas inlet seals, fitting seals, slit valve gates, lip seals, wafer handling parts, etc. used in the semiconductor industry.
 
KATON^® PF92T can be combined with the cure system and other typical fluoroelastomer compounding ingredients; their mixing can be accomplished with two roll mills or internal mixers. Finished goods may be produced by a variety of rubber processing methods. If only liquid peroxide is added to the polymers during the compounding stage, translucent items are produced.

The main properties of KATON^® PF92T Series are as follows:
• High purity (low amount of extractables)
• Very good oxygen and fluorine plasma resistance
• Very low particle generation
• Low out gassing
• Low friction
• High abrasion resistance
• Low modulus
• Excellent mechanical and sealing properties