TPF O-Ring | Perfluoropolymer Seal for Harsh Chemicals | Max | OEM O-Ring Manufacturer | Custom FFKM & FKM Seals
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TPF O-RING
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TPF O-RING
Description:
Maxmold TPF fluoroelastomers (thermoplastic TPF fluoroelastomer) are designed for high performance applications where both purity and chemical resistance are required, mainly for semiconductor manufacturing applications.
Maxmold TPF O-Rings – Cleanroom-Grade Plasma-Resistant Filler for Semiconductor Seals
Maxmold TPF O-Rings are advanced plasma-resistant filler developed for high-purity fluoroelastomer compounds used in semiconductor manufacturing. Unlike traditional fillers such as carbon black or mineral additives (e.g., BaSO₄, TiO₂, SiO₂), TPF reinforces the base material without generating contaminating particles. It enables the production of low-outgassing, particle-free sealing components suitable for critical cleanroom environments.


No Conventional Fillers: Eliminates use of minerals that can leave discrete particles when etched by plasma.

Fully Etchable Composition: Uses polymeric fillers with etching rates similar to the base fluoroelastomer, minimizing particle generation during plasma exposure.

Excellent Plasma Resistance: Withstands oxygen and fluorine plasma, ideal for dry etch and CVD processes.

High Purity & Cleanliness: Low extractables, minimal outgassing, and extremely low particle shedding.


Application Range
PF92T is ideal for semiconductor sealing applications across a wide temperature range of –10°C to 230°C. It is suitable for both dry and wet processes, including:
  • Plasma Etching, PECVD, LPCVD, Metal CVD, PVD, ALD
  •  
  • Wafer Cleaning, Polymer Removal, Wet Etching, CMP

Common applications
Maxmold TPF O-Rings are used in the production of precision sealing components such as:
  • Chamber seals
  •  
  • Lid and window seals
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  • Gas inlet seals
  •  
  • Slit valve gates
  •  
  • Lip seals
  •  
  • Wafer handling components


Material Properties
  • High purity, low extractables
  •  
  • Excellent oxygen and fluorine plasma resistance
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  • Very low particle and outgassing levels
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  • High abrasion resistance and low friction
  •  
  • Low modulus with strong mechanical and sealing properties



 
Cost Performance Ratio
FK1 FK2 FK3 FK5 FVQM FEPM FFKM
★
(
Low Price)
★★
(
General Price)
★★★★
(
High Cost)
★★★
(
Median Price)
★★★★
(
High Cost)
★★★★
(
High Cost)
★★★★★
(Very 
High Cost)
 
Model Table
Model Color Shore A Material Cross-Linking Remarks
TPF Translucent Off-White 70 & 75 TPF Peroxide Anti-ozone plasma,
no wheel marks
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MAXMOLD
Polymer Co., Ltd

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  • SERVICE@maxmold.com
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